Today, distance sensors are playing an increasingly important role as a key enabling component in the development of such technologies. Distance Image sensors measure the distance to an object per pixel, using an indirect TOF (time-of-flight) method. It is the optimum sensor for people and object detection, and shape recognition for applications where touchless or labour-saving technology is required.
To meet the needs of these applications, Hamamatsu Photonics introduce a new range of 3D time-of-flight back-thinned image sensors. Through back-thinning, these new sensors deliver high sensitivity in the near-infrared region. An integrated active circuitry improves the tolerance to background light and makes these 2nd generation distance sensors ideal for measurement applications including hygiene management, measurement for social distancing and remote operations. These new image sensors are also available in a compact wafer-level package.
Hamamatsu is able to offer evaluation kits to aid development, and customised solutions to meet your specific application needs.
Hamamatsu Photonics Deutschland GmbH
Arzberger Str. 10
82211 Herrsching am Ammersee
Telefon: +49 (8152) 375-0
Telefax: +49 (8152) 375-199
Telefon: +49 (8152) 375-185
Fax: +49 (8152) 375-199