“As a form-factor standard that defines extremely high I/O and computer performance levels for small form-factor physical AI applications all the way up to embedded servers and workstations, COM-HPC has proven extremely successful since PICMG first ratified it in 2021,” said Christian Eder, chairman of the COM-HPC working group and director of market intelligence, congatec. “congatec has continued to play a pivotal role in developing and actualizing the COM-HPC standard from the start. And we are fully committed to supporting the standard in all stages of its evolution.

“This includes our support for the PICMG COM-HPC Carrier Design Guide, Rev. 2.3. This guide provides OEMs with comprehensive technical details for developing secure, application-specific carrier or baseboards that offer all the benefits of open standards — including flexible design choices,” added Eder.

About the PICMG Carrier Design Guide, Rev. 2.3

The COM-HPC Carrier Design Guide, Rev. 2.3 clarifies the slight modifications needed to apply COM-HPC Client examples to COM-HPC Mini designs. It should be used in combination with the COM-HPC Base Specification, with other industry specifications (listed in Section 1.9. of the new design guide), with silicon and component vendors’ documentation, and with COM-HPC module vendors’ product documentation.

The design guide is available for free download from the PICMG website:

https://www.picmg.org/wp-content/uploads/PICMG_COMHPC_CDG_R2_3-1.pdf