Press releases worldwide
Ultrasonic wire bonding has been established as a contacting method in the microelectronics and semiconductor industry for many years. The technology is also ideally suited for electrically interconnecting battery cells. To ensure one of the most important prerequisites for high-quality […]
Whether for downstream processes or to ensure the lasting and reliable function of a product, rising requirements for particulate and filmic-chemical component cleanliness are increasingly causing cleaning tasks to be shifted to clean environments. For these applications, acp systems has […]
Innovative hot stamping technology coupled with optimally coordinated dry snow-jet cleaning produces plastic surfaces that meet the highest demands in terms of design and functionality – BAIER Prägetechnik has realized this user advantage through its cooperation with acp systems. Optionally […]