The Mexico Technology Awards recognize innovations that advance electronics manufacturing. The RDS UV LED was recognized for its innovative approach to curing conformal coatings, adhesives and potting compounds, combining reliable process results with short cycle times and significantly lower energy consumption.

“This award is a special recognition of the development efforts of our entire team and encourages us to continue exploring new approaches to electronics manufacturing,” said Luis Garcia, General Manager of Rehm Mexico. “Our customers are facing the challenge of making their production processes more efficient while also reducing their environmental impact. That's exactly where the RDS UV LED makes a difference. It delivers reliable curing results, reduces energy consumption and integrates easily into existing production lines. Receiving this recognition here in Mexico makes it especially meaningful to us.”

Uniform UV Curing Through Stationary Exposure

What sets the RDS UV LED apart from conventional UV curing systems is its unique exposure concept. In traditional conveyor-based systems, printed circuit boards move continuously beneath a UV radiation source. With the RDS UV LED, the assembly remains stationary throughout the exposure process, allowing the entire activated area to be irradiated simultaneously for a precisely defined period.

This approach makes curing conditions easier to control and reproduce, as the exposure process is no longer affected by conveyor speed or position-dependent dwell times. For complex assemblies with components of varying heights, stationary exposure also helps reduce unwanted shadowing effects and achieve a more consistent UV dose.

The system features a 500 × 500 mm UV LED panel divided into four independently controllable segments. Depending on the PCB format, only the segments required for the active process area are switched on. Targeted exposure beyond the PCB edges further improves irradiation uniformity, achieving homogeneity levels of more than 90 percent for PCB formats up to 410 × 410 mm.

Selectable wavelengths of 365, 385, 395 and 405 nm allow the system to be adapted to different conformal coatings, adhesives and other UV-curable materials.

Lower Energy Consumption, Smaller Footprint, Higher Productivity

Process reliability was not the only priority in developing the RDS UV LED. Economic efficiency and sustainability were equally important. Typical exposure times of just a few seconds enable short production cycles and high throughput in electronics manufacturing.

One of the system's key benefits is its low energy consumption. Compared with conventional UV lamp systems, the RDS UV LED can reduce energy use by up to 70 percent. The LED modules are activated only when needed, eliminating the need to keep the radiation source running during production interruptions.

The compact design also saves valuable production space. Requiring up to 70 percent less floor space than conventional systems, the RDS UV LED is particularly well suited to manufacturing environments where efficient use of space is essential.

Additional benefits include LED module lifetimes exceeding 20,000 operating hours, low maintenance requirements and mercury-free operation. Since UV LED technology also minimizes unnecessary thermal radiation, it helps protect temperature-sensitive electronic assemblies.

Designed for Connected Electronics Manufacturing

The RDS UV LED is designed for inline integration into existing coating and electronics production lines. Communication interfaces such as SMEMA, Hermes and CFX, as well as connectivity to MES solutions, enable data exchange in connected manufacturing environments.

Rehm's ViCON operating and control software allows relevant process parameters to be configured, monitored and documented. These include exposure time, intensity, activated LED segments and temperature values. This provides greater process transparency and supports consistent quality assurance.

Receiving the Mexico Technology Award in conjunction with SMTA Guadalajara is an important recognition of Rehm Thermal Systems' ongoing development of UV LED curing technology. The RDS UV LED demonstrates how process reliability, productivity and resource efficiency can work together in modern electronics manufacturing.

Bondexpo covers the entire process chain for adhesive bonding, potting, sealing and foaming. This makes the trade fair an ideal platform for Rehm Thermal Systems to demonstrate solutions that combine highly precise material application with powerful curing technology.

ProtectoXC: Flexible Dispensing Solution for Dispensing, Bonding and Potting

With the ProtectoXC, Rehm is presenting a compact and versatile platform for demanding dispensing and application tasks. At Bondexpo, the focus will be on applications in the areas of dispensing, bonding and potting.

The system enables precise and reproducible processing of a wide range of materials and is suitable for numerous applications in modern electronics and assembly production. These include the selective application of adhesives, the dispensing of potting compounds as well as various bonding and underfill processes.

Thanks to its flexible system configuration, different application methods and materials can be processed reliably. Applications such as globe top, dam & fill and flip-chip underfill can be implemented just as effectively as the selective or contour-accurate application of adhesive and potting materials.

To ensure a high level of repeatability and process stability, the ProtectoXC features functions such as automatic needle measurement. Application tools can therefore be checked and, where necessary, automatically corrected. Heated nozzles also help maintain a constant material temperature and therefore stable dispensing conditions.

Operation and programming are carried out via the ViCON Protecto software with a modern touch interface. This allows even more complex dispensing processes to be set up clearly and adapted to different products and applications.

RDS UV LED: Fast Curing with Significantly Reduced Energy Consumption

As its second exhibit, Rehm will present the RDS UV LED at Bondexpo. The system has been developed for the reliable curing of UV-reactive adhesives, potting compounds and other UV-curing materials and combines short process times with high energy efficiency.

The stationary full-area exposure ensures homogeneous illumination of the entire assembly and supports reproducible curing even with demanding geometries. Four individually controllable UV LED segments make it possible to adapt the exposure flexibly to the respective product and process.

A key advantage of LED technology is its immediate readiness for use without any warm-up time. At the same time, energy consumption can be significantly reduced compared with conventional UV lamps. Depending on the application, exposure times are only a few seconds.

Since UV LED technology operates without conventional infrared radiation, temperature-sensitive assemblies and components in particular benefit from reduced thermal stress.

The RDS UV LED also offers a high degree of flexibility when it comes to material selection. In addition to materials specifically optimised for LED applications, a wide range of UV-reactive systems can be processed. This makes the system suitable for a broad range of industrial applications involving bonding, potting and coating.

Dispensing and Curing as an Integrated Process

With the combination of ProtectoXC and RDS UV LED, Rehm will demonstrate at Bondexpo how two technologies can complement each other within modern bonding, dispensing and potting processes. Precise material application, flexible process design and efficient UV curing provide the basis for stable and reproducible production processes.

Visitors to Bondexpo will have the opportunity to experience both systems up close at the Rehm booth and discuss individual applications, materials and process requirements with Rehm experts.

Rehm Thermal Systems at Bondexpo 2026
6 to 8 October 2026
Messe Stuttgart
Booth 6505
Further information:
www.rehm-group.com
www.bondexpo-messe.de

Electronic assemblies perform key functions in safety-critical applications – from airbag systems in vehicles to sensors in aircraft or industrial control systems. To provide long-term protection against moisture, dust, corrosion, vibration and thermal stress, assemblies are often coated, encapsulated or potted and then reliably dried or cured.

The requirements for these processes are diverse: the product, coating material, solvent content, throughput and temperature-time profile determine the system design. Key factors include temperature homogeneity, reproducibility, energy efficiency and simple integration into existing production lines. Rehm Thermal Systems develops customized drying and curing systems that are precisely tailored to the product, process and production environment.

The portfolio ranges from horizontal and meander dryers to magazine dryers and UV systems, as well as reel-to-reel solutions for flexible substrates and compact vertical dryers. Especially where production space is limited, the vertical drying concept is becoming increasingly important: the vertical dryer makes use of the available room height and enables high process capacity with a minimal footprint.

The new RVDS vertical dryer from Rehm for reliable coating drying and curing of electronic assemblies

When drying processes need to be safe, reproducible and space-saving at the same time, Rehm’s vertical dryer is the ideal solution. The system has been developed for drying and curing a wide variety of assemblies and combines high process stability with an extremely compact design. Thanks to the vertical transport principle, valuable production space is saved without compromising on quality, temperature control or throughput.

Compact design for high performance

The new Rehm vertical dryer combines high thermal performance with an exceptionally small footprint. The system dimensions are approximately 2.5 m in width, 2.0 m in depth and 3.9 m in height. This makes the system especially suitable for production environments where floor space is limited and efficiency per square meter is crucial.

Designed for demanding assemblies

The system concept is designed for carrier sizes of 500 × 500 mm and can process products of up to 420 × 400 × 110 mm, with a product weight of around 3,000 g. This makes the vertical dryer suitable not only for conventional coated PCBs, but also for larger and more complex assemblies that need to be guided securely and tempered reproducibly.

Precise temperature control for stable results

The heating system operates according to the convection principle with circulating air. Several separately controllable heating zones allow the process to be precisely adapted to the coating application quantity, solvent throughput and product specification. Targeted airflow in the process towers ensures homogeneous heating of the assemblies and creates the basis for reproducible process sequences and high product quality. Separately controllable heating zones, individually adjustable supply and exhaust air, and an optional segmented cooling section ensure an optimal airflow concept within the process chamber.

Intelligent carrier and stacking concept

A central feature of the system is the vertical stacking principle. The products are transported on specially designed carriers. Centering spacer elements enable the carriers to be stacked safely and precisely. With up to 20 product carriers per stack, high capacity is achieved in a very compact system design.

Clean transport principle for sensitive electronics

Transport through the system is carried out via a vertical circulation and transfer system with defined lifting and transfer movements. The carriers in the process towers are stacked on top of each other and guided through the system by lift, longitudinal transport and transfer units. The result is a clean, controlled material flow combined with high process density. In addition, conventional chain and lubricant concepts can be avoided in the hot process area, reducing the risk of contamination for sensitive assemblies.

Flexible loading concepts for different production environments

The vertical dryer is not limited to a single line concept, but is designed for several loading variants:

• automatic inline loading
  • manual loading
  • optional robotic loading

This allows the system to be adapted to different levels of automation and production structures. Particularly important: according to the concept, manual loading must also be possible. This significantly expands the range of applications, for example in pilot production, flexible lines or production environments with frequently changing batch sizes.

Adaptable to your production line

The system can be designed with several configuration options. These include different loading and unloading positions, various loading methods, and the design of the stack height or the number of carriers in circulation. Alternative unloading positions are also possible in order to optimally adapt the layout to the production line. This allows the vertical dryer to be specifically tailored to the available space, material flow and desired level of automation.

Cooling, protecting and further processing

The system can optionally be equipped with segmented cooling in the second tower. This ensures controlled and product-friendly cooling after the thermal process. It supports stable results and safe further processing downstream.

Developed for modern electronics manufacturing

Whether automotive, aerospace, industrial electronics or other applications with high requirements for drying processes and reliability: Rehm’s vertical dryer supports stable, documentable and economical processes. By combining a vertical system concept, clean carrier transport and flexible integration options, it provides a future-proof solution for modern electronics manufacturing.

Rehm Thermal Systems supports users as early as the concept phase in defining the optimal technology and process parameters. The result is customized drying solutions that sustainably improve quality, cost-effectiveness and reliability in electronics manufacturing.

In Hall 9, Booth 9C19, trade visitors can look forward to a varied program covering modern manufacturing processes, reflow soldering, automation, digitalization and connected production solutions. The focus will be not only on new technologies, but above all on the specific challenges encountered in day-to-day production.

As a launch partner and member of the Exhibitor Advisory Board, Rehm Thermal Systems has actively supported the development of the new event format from the outset. Working together with Messe Stuttgart and other industry representatives, the company is contributing its many years of experience in electronics manufacturing to establish EFX as a forward-looking platform for knowledge transfer, innovation and face-to-face exchange.

The new industry event addresses key topics shaping the future, including smart manufacturing, digitalization, automation and sustainability. Manufacturers, users and partners will have the opportunity to learn about the latest developments, share experiences and jointly develop new ideas for competitive electronics production.

Expert Knowledge for Day-to-Day Production

On all three days of the trade fair, Rehm Thermal Systems will offer a varied program of practical technical presentations and personal discussions. The company’s experts will demonstrate how processes can be systematically optimized, resources used more efficiently and employees prepared for new requirements.

The following topics are on the program:

• Qualifying Your Employees
  Walter Seng, Rehm Academy
• Greater Efficiency and Reduced Resource Consumption in Reflow Soldering
  Dr. Paul Wild, Head of Research and Development, and Julian Klaiber, Head of Internal Sales
• Preventing Coating Defects: Identifying Causes and Systematically Optimizing Processes
  Gianfranco Sinistra, Director Sales Conformal Coating & Dispensing
• Everything You Were Afraid to Ask About Soldering
  Helmut Öttl, Technical Process Consultant
• ViCON Connect, ViCON App and ViCON Aide: Digital Support for Your Processes and Production Control
  Rehm software specialists
• Rehm Line Automation Concepts
  Lisa Leonhardt, Senior Manager Line Solutions
• Integrated Solutions for Connected Production Lines
  Gianfranco Sinistra, Rehm, and Markus Scheid, Managing Director of RESITCO GmbH

The program combines in-depth expertise with practical ideas for day-to-day production. Visitors will be able to discuss their individual questions directly with the specialists and work with them to develop potential solutions for their manufacturing operations.

Personal Exchange Through Bar Talks and Networking

The experts will also be available for discussions away from the Rehm booth. During the Bar Talks at the EFX Café and EFX Bar, participants can explore selected topics in greater depth in an informal setting, gain new perspectives and make valuable contacts within the electronics industry.

Wednesday, October 7, 2026 | 10:00 a.m.
EFX Bar Talk: Ensuring Coating Quality—Optimizing Material Handling and Process Conditions, Avoiding False Alarms
With Gianfranco Sinistra, Rehm Thermal Systems, and Michael Zahn, Koh Young Europe GmbH

Wednesday, October 7, 2026 | 4:00 p.m.
EFX Café: Soldering Consultation
With Helmut Öttl and Dr. Paul Wild, Rehm Thermal Systems

Thursday, October 8, 2026 | 11:45 a.m.
EFX Bar: Increasing Efficiency Through Automation and Connectivity
With Gianfranco Sinistra, Rehm Thermal Systems, and Markus Scheid, RESITCO GmbH

“As a launch partner and member of the Exhibitor Advisory Board, we have supported EFX with great commitment from the very beginning. The new format provides the industry with an excellent platform for sharing knowledge, engaging in dialogue and jointly developing new ideas. Through our program, we aim to make technological solutions clear and tangible, discuss specific practical challenges and provide inspiration for more efficient and future-ready electronics manufacturing,” explains Carmen Hilsenbeck, Head of Marketing at Rehm Thermal Systems.

As a specialist in thermal system solutions, Rehm helps companies implement reliable, high-performance and cost-effective production processes. Its portfolio includes solutions for reflow soldering, drying, curing and coating, as well as automated and connected manufacturing processes.

At EFX 2026, visitors will be able to discuss their individual requirements with Rehm’s experts, learn about new technologies and take away practical ideas for advancing their electronics manufacturing operations.

Rehm Thermal Systems at EFX 2026
October 6–8, 2026
Messe Stuttgart
Hall 9, Booth 9C19
https://www.messe-stuttgart.de/efx/en/

Please find attached the following image materials: EFX banner and key details of the Rehm booth. (Images provided for communication purposes by EFX, Messe Stuttgart and Rehm Thermal Systems.)

Compared with conventional UV systems using mercury vapor lamps, UV LED technology requires no warm-up time, is ready for operation immediately and can be precisely controlled. It is mercury-free, does not generate ozone at the relevant UVA wavelengths and reduces heat input into the assembly. This offers clear advantages for future-proof production, especially when processing temperature-sensitive components, meeting increasing sustainability requirements and addressing the growing importance of traceability.

Stationary Full-Area Exposure as the Core of the Process

The central process principle of the RDS UV LED is stationary full-area exposure. While continuous systems can be influenced by transport dynamics, belt speed and position-dependent dwell times, the PCB in the RDS UV LED remains fixed in position during the defined exposure time and is irradiated simultaneously across the entire activated area. This creates reproducible conditions: exposure time, intensity, working distance and active segment areas can be clearly defined and stored in recipes.

This concept enhances process reliability, particularly for assemblies with different component heights. Distance and alignment remain constant during the exposure step; shadowed areas and fluctuations caused by relative motion are reduced. For users, this means uniform curing across the entire usable area and therefore high coating quality, even with demanding layouts and sensitive coating systems.

Homogeneity Through Segmentation and Targeted Overexposure

The RDS UV LED operates with a 500 x 500 mm UV LED exposure field. The LED light source consists of four separately controllable segments, each 125 mm wide, which are activated depending on the defined PCB width. This ensures that only the area actually required is activated. It reduces unnecessary energy input outside the usable area and supports gentle thermal process control.

For the quality of UV curing, maximum intensity alone is not decisive; the uniformity of the radiation distribution is equally important. The system concept therefore provides for targeted overexposure beyond the PCB edge: for PCB sizes of up to 410 x 410 mm, 45 mm of overexposure is available on each side. As a result, the assembly is positioned within the particularly homogeneous area of the exposure field, with homogeneity distribution of up to 95%. As an option, the system can process PCBs up to 500 x 500 mm; when the full exposure field is used, edge homogeneity must be evaluated depending on the application.

Defined Wavelengths for Controlled Curing

UV LED systems do not emit a broad spectrum, but defined wavelengths. The RDS UV LED is designed for modules with 365, 385, 395 or 405 nm. This allows the irradiated energy to be precisely matched to the respective coating or adhesive system. The appropriate wavelength is selected depending on the photoinitiators, layer thickness and material approval. Rehm Thermal Systems points out that switching from broadband UV to UV LED is not simply a matter of replacing a lamp: for stable results, wavelength, dose, intensity, homogeneity, temperature control and material chemistry must be validated together.

The precise controllability of UV LED technology opens up a very robust process window. Since LED modules reach full output without preheating time, they can be activated precisely in line with the production cycle and switched to standby mode during pauses. This lowers energy demand and simplifies process control. At the same time, the long service life of the LED modules, exceeding 20,000 operating hours, reduces maintenance requirements and increases system availability.

Compact, Integrated and Industry 4.0-Ready

The RDS UV LED was developed to meet the requirements of modern electronics production lines. In semi-batch operation, the system combines the advantages of stationary exposure with the requirements of inline production and enables cycle times of just a few seconds. Automatic transport width adjustment covers a range from 50 to 508 mm. The system is designed as an inline solution and prepared for integration into digitalized manufacturing concepts.

Traceable process values may include exposure time, intensity, active UV LED segments, segment temperatures, operating hours and system status messages. Interfaces such as SMEMA, Hermes or MES connectivity allow the curing process to be linked with quality-relevant production data. The user-friendly ViCON software supports operation via touch functions and clearly displays key system and process information.

Sustainability with Economic Benefits

In addition to process quality, the RDS UV LED drying system addresses key economic and sustainability objectives. UV LED technology enables up to 70% lower energy consumption compared with conventional UV lamps and up to 70% less footprint. The exhaust air volume is 500 m³/h, which is significantly lower than in many conventional systems. Since no mercury-containing emitters are used and no ozone is generated, the oven supports environmentally friendly and legally compliant production processes.

“With the RDS UV LED, we think of UV curing as a controlled process – not merely as a light source,” says Manuel Schwarzenbolz, Research & Development at Rehm Thermal Systems. “Stationary full-area exposure, segmentation, homogeneity management and digital process data create the basis for reproducible quality, short cycle times and resource-efficient electronics manufacturing.”

RDS UV LED Product Information at a Glance

The RDS UV LED cures UV conformal coatings, adhesives and potting compounds quickly, uniformly and resource-efficiently. Key elements include a 500 x 500 mm UV LED panel, four segments of 125 mm each, defined wavelengths of 365, 385, 395 or 405 nm, stationary full-area exposure, overexposure of up to 45 mm on each side for high edge homogeneity, low thermal load, LED modules with more than 20,000 operating hours, automatic transport width adjustment from 50 to 508 mm, the ViCON user interface, and compatibility with inline production, MES and Hermes.

Electronic assemblies perform key functions in safety-critical applications – from airbag systems in vehicles to sensors in aircraft or industrial control systems. To provide long-term protection against moisture, dust, corrosion, vibration and thermal stress, assemblies are often coated, encapsulated or potted and then reliably dried or cured.

The requirements for these processes are diverse: the product, coating material, solvent content, throughput and temperature-time profile determine the system design. Key factors include temperature homogeneity, reproducibility, energy efficiency and simple integration into existing production lines. Rehm Thermal Systems develops customized drying and curing systems that are precisely tailored to the product, process and production environment.

The portfolio ranges from horizontal and meander dryers to magazine dryers and UV systems, as well as reel-to-reel solutions for flexible substrates and compact vertical dryers. Especially where production space is limited, the vertical drying concept is becoming increasingly important: the vertical dryer makes use of the available room height and enables high process capacity with a minimal footprint.

The new RVDS vertical dryer from Rehm for reliable coating drying and curing of electronic assemblies

When drying processes need to be safe, reproducible and space-saving at the same time, Rehm’s vertical dryer is the ideal solution. The system has been developed for drying and curing a wide variety of assemblies and combines high process stability with an extremely compact design. Thanks to the vertical transport principle, valuable production space is saved without compromising on quality, temperature control or throughput.

Compact design for high performance

The new Rehm vertical dryer combines high thermal performance with an exceptionally small footprint. The system dimensions are approximately 2.5 m in width, 2.0 m in depth and 3.9 m in height. This makes the system especially suitable for production environments where floor space is limited and efficiency per square meter is crucial.

Designed for demanding assemblies

The system concept is designed for carrier sizes of 500 × 500 mm and can process products of up to 420 × 400 × 110 mm, with a product weight of around 3,000 g. This makes the vertical dryer suitable not only for conventional coated PCBs, but also for larger and more complex assemblies that need to be guided securely and tempered reproducibly.

Precise temperature control for stable results

The heating system operates according to the convection principle with circulating air. Several separately controllable heating zones allow the process to be precisely adapted to the coating application quantity, solvent throughput and product specification. Targeted airflow in the process towers ensures homogeneous heating of the assemblies and creates the basis for reproducible process sequences and high product quality. Separately controllable heating zones, individually adjustable supply and exhaust air, and an optional segmented cooling section ensure an optimal airflow concept within the process chamber.

Intelligent carrier and stacking concept

A central feature of the system is the vertical stacking principle. The products are transported on specially designed carriers. Centering spacer elements enable the carriers to be stacked safely and precisely. With up to 20 product carriers per stack, high capacity is achieved in a very compact system design.

Clean transport principle for sensitive electronics

Transport through the system is carried out via a vertical circulation and transfer system with defined lifting and transfer movements. The carriers in the process towers are stacked on top of each other and guided through the system by lift, longitudinal transport and transfer units. The result is a clean, controlled material flow combined with high process density. In addition, conventional chain and lubricant concepts can be avoided in the hot process area, reducing the risk of contamination for sensitive assemblies.

Flexible loading concepts for different production environments

The vertical dryer is not limited to a single line concept, but is designed for several loading variants:

• automatic inline loading
  • manual loading
  • optional robotic loading

This allows the system to be adapted to different levels of automation and production structures. Particularly important: according to the concept, manual loading must also be possible. This significantly expands the range of applications, for example in pilot production, flexible lines or production environments with frequently changing batch sizes.

Adaptable to your production line

The system can be designed with several configuration options. These include different loading and unloading positions, various loading methods, and the design of the stack height or the number of carriers in circulation. Alternative unloading positions are also possible in order to optimally adapt the layout to the production line. This allows the vertical dryer to be specifically tailored to the available space, material flow and desired level of automation.

Cooling, protecting and further processing

The system can optionally be equipped with segmented cooling in the second tower. This ensures controlled and product-friendly cooling after the thermal process. It supports stable results and safe further processing downstream.

Developed for modern electronics manufacturing

Whether automotive, aerospace, industrial electronics or other applications with high requirements for drying processes and reliability: Rehm’s vertical dryer supports stable, documentable and economical processes. By combining a vertical system concept, clean carrier transport and flexible integration options, it provides a future-proof solution for modern electronics manufacturing.

Rehm Thermal Systems supports users as early as the concept phase in defining the optimal technology and process parameters. The result is customized drying solutions that sustainably improve quality, cost-effectiveness and reliability in electronics manufacturing.

With this comprehensive commitment, Rehm underscores the strategic importance of the Mexican market for electronics manufacturing. In recent years, Mexico has developed into one of the most important production locations on the American continent. In particular, the automotive, industrial electronics, consumer electronics and EMS segments continue to benefit from the ongoing expansion of local manufacturing capacities. In addition, there is a strong nearshoring trend: more and more international companies are relocating production volumes to Mexico in order to shorten supply chains, manufacture more flexibly and be closer to their sales markets in North and South America. This is generating growing demand for powerful, reliable and process-safe thermal system solutions – an environment in which Rehm is ideally positioned thanks to its local presence and strong application expertise.

“Mexico has been far more than just a sales market for Rehm for many years – it is a key growth location with great technological potential. Our role as the main sponsor at all major SMTA Expos 2026 is therefore a clear commitment to our customers in the region and to the continued development of the market,” emphasizes Luis A. García, Managing Director of Rehm Thermal Systems Mexico.

Rehm has maintained its own subsidiary in Mexico for many years and has continuously expanded its activities there. What began with a small team has developed into a strong national organization with its own infrastructure, local service, spare parts warehouse and a modern Technology Center. In 2024, the company also moved into a new building with 960 m² of space in a modern industrial park in Guadalajara – an important step in enabling further growth and supporting customers even more comprehensively on site.

A key pillar of this market presence is the Technology Center in Mexico. There, Rehm offers far more than traditional machine presentations: customers and interested parties gain access to hands-on process consulting, application know-how and realistic tests under production conditions. With well-founded consulting, Rehm supports not only machine-specific issues, but also the design of complete process chains and economic evaluations, for example with regard to total cost of ownership. According to the company, dedicated application teams are available at the Technology Centers in Germany, the USA, Mexico and China to determine optimum parameters for a wide range of manufacturing requirements. Training sessions, workshops and seminars are also offered in Guadalajara.

This creates tangible added value for Rehm customers in Mexico: new products and processes can be validated at an early stage, applications can be tested, and individual manufacturing solutions can be developed in a targeted manner – from reflow soldering processes and condensation soldering to coating, drying and testing applications. Being close to the market shortens distances, speeds up coordination and enables much more intensive technical exchange. Especially in an environment where quality, speed and process stability are critical, this local support is a key success factor.

For Rehm, the SMTA Expos in Mexico are therefore far more than mere trade show appearances. They reflect the company’s close connection to the local electronics ecosystem – and provide a platform for discussing current requirements and future developments with customers, partners and industry professionals. In particular, these regional formats provide access to the country’s most important manufacturing centers and bring together decision-makers, process specialists and technology providers at each industrial location.

Electronics manufacturing is increasingly shaped by smart factory concepts, e-mobility, and the continuous expansion of 5G infrastructure. As requirements for precision, energy efficiency, and connectivity continue to grow, Rehm Thermal Systems will present its latest process solutions at Asia’s leading trade fairs in spring 2026. With appearances in China, South Korea, and India, the company is further expanding its presence in one of the world’s most dynamic electronics markets.

Nelson Chong, Sales Manager Rehm ASEAN, underlines the strategic relevance of these events:

“The Asian market is one of the key driving forces behind the global electronics industry. Trade fairs in China, Korea, and India are essential platforms for us to showcase our technological leadership in reflow soldering and conformal coating. Just as importantly, they allow us to engage directly with our customers and partners and to develop tailored solutions for the challenges of digital manufacturing.”

Trade fair highlights at a glance

productronica China, Shanghai (March 25–27, 2026)

At productronica China, the focus will be on future-oriented technologies such as AI, autonomous robotics, and power semiconductors. Rehm will present highly flexible systems including the Protecto series for precise dispensing and coating, the Vision series for reflow soldering, and the Condenso product line for vapor phase soldering. Equipped with optional formic acid technology that can be integrated directly into the process, these solutions are specifically designed to meet the demanding quality standards of the automotive and semiconductor industries.

Smart SMT & PCB Assembly (SSPA), Korea (April 1–3, 2026)

In South Korea, the emphasis is on maximum process stability and sustainability. At SSPA, Rehm will showcase advanced vacuum technologies. A key highlight is the Condenso system, which reliably solders even highly demanding assemblies at temperatures of up to 240 °C. Its patented injection process enables individual control of the soldering process and ensures precise profile management. An optional vacuum module delivers void-free solder joints either directly after soldering or as a pre-vacuum step.

productronica India, Greater Noida (April 8–10, 2026)

With the recent opening of its own subsidiary in Bengaluru, Rehm is further reinforcing its commitment to the fast-growing Indian market. At the trade fair in Greater Noida, the team will present solutions designed to support local manufacturers in scaling their production operations — from the cost-efficient VisionXC for nitrogen reflow soldering to fast-response service concepts enabled by the new local application center.

NEPCON China, Shanghai (June 2–4, 2026)

At NEPCON China in Shanghai, Rehm will present innovative reflow technology for electronics manufacturing. The spotlight will be on the VisionXP+ VAC with vacuum chamber. This system enables convection soldering under reduced pressure and reliably removes pores, gas inclusions, and voids directly after the soldering process. Visitors will experience powerful and efficient solutions designed to deliver maximum process reliability, outstanding quality, and sustainable manufacturing performance for modern electronics production in one of Asia’s most dynamic markets.

Beyond these events, Rehm continues to underline its strong presence across Mainland China and the ASEAN region through regular participation in other major industry trade fairs and specialist events. These include exhibitions such as NEPCON Shenzhen China, SEMICON Taiwan, and further electronics events throughout Asia, where Rehm maintains close dialogue with customers and partners while strengthening the visibility of its technologies in regional markets.

Attached image material: Impressions from Asian Events 2025 (Photos: Rehm Thermal Systems)

Michael Hanke, Chief Sales Officer, Rehm Thermal Systems:
“Requirements in electronics manufacturing are rising rapidly—especially in terms of quality, efficiency, and sustainability. At IPC APEX EXPO 2026, we will demonstrate in a practical way how our systems for coating, dispensing, and vapor phase and reflow soldering stabilize processes, save resources, and give our customers a true competitive edge.”

At booth 942, Rehm experts will demonstrate the versatile applications of the ProtectoXC dispensing and coating system live and provide insights into more economical vapor phase soldering with the Condenso series and its integrated closed-loop system. In addition, we will exhibit a VisionXC reflow soldering system and share insights into high-performance reflow processes for modern assembly requirements.

Flexible coating and dispensing with the Protecto series

Conformal coating has become indispensable in today’s production environment, reliably protecting electronic assemblies from harsh environmental influences. With the Protecto series, Rehm Thermal Systems offers a platform that supports not only automated coating but also bonding, sealing, and fixing applications. Using the system’s applicators, up to four different materials can be applied “on the fly.” Operation is via the ViCON Protecto software with intuitive, user-friendly functions and flexible access across different devices. This enables manufacturers to respond quickly to market changes and customer-specific requirements in coating and dispensing.

Resource-efficient vapor phase soldering with the Condenso series

Vacuum soldering has long been a proven method in vapor phase systems to significantly reduce voids in solder joints. With the integrated closed-loop system of the Condenso product line for the injected medium Galden®, Rehm supports more economical vapor phase soldering. After soldering, process gas is extracted and cleaned; the Galden® is filtered and purified so that around 99.9% of the medium can be recovered. This reduces consumption and costs, minimizes maintenance effort, and supports stable processes with fewer defective products.

VisionXC reflow soldering system for maximum process reliability

With the VisionXC Nitro, Rehm presents a reflow soldering system with a nitrogen atmosphere for maximum process reliability and reproducible soldering quality: the protective gas minimizes oxidation and improves wetting, also supporting lead-free soldering processes. A modular system concept and a tailored transport solution (including single/dual-lane options and SMEMA/Hermes compatibility) enable flexible production across varying throughput and batch sizes. A multi-zone heating concept with individually controllable zones and controlled cooling ensures precise profiles and high process stability with minimal ΔT. Intelligent flux management (MARS & FMS) keeps the process atmosphere clean, extends maintenance intervals, and supports consistently stable conditions and high system availability.

We look forward to welcoming you at booth 942 and to discussing the specific challenges of your production in person.

Attached image material: Impressions from IPC APEX EXPO 2025 (Photo: Rehm Thermal Systems)