Mapping Sensor from Balluff– Precision in the smallest possible space

For wafer mapping Balluff offers a highly precise photoelectric sensor which integrates perfectly into the end effectors. Especially designed for extremely thin end effectors, the compact BOH TI-R002 mapping sensor features an extremely controlled and focused light spot with outstanding homogeneity. It offers the highest precision in the smallest possible space, reliably detecting the edges Read more about Mapping Sensor from Balluff– Precision in the smallest possible space[…]

Compact laser light array with IO-Link

When various objects have to be identified in production, packaging or in quality control, the compact and multi-functional BLA 16C laser light array is ideal. This through-beam sensor from Balluff with IO-Link offers numerous measuring modes such as object diameter, object position, gap width, gap position or edge position. Additional modes such as counting or Read more about Compact laser light array with IO-Link[…]

Magnetic encoder system with Drive-Cliq interface

The BML absolute magnetic encoder in the SGA series stands out in any application where high absolute accuracy of position and end-of-travel is required. Comprehensive diagnostics functions ensure reliable operation and more efficient maintenance. With its Drive-Cliq interface the Balluff measuring system can also be perfectly integrated into Siemens controller environments. Siemens has certified the Read more about Magnetic encoder system with Drive-Cliq interface[…]

Intelligent position measuring system for absolute linear feedback

With their BMP series Balluff has added a new intelligent displacement sensor which provides not only the absolute position signal for the stroke travel of a piston via IO-Link but also information about the sensor status and the current ambient conditions. It monitors for example the sensor temperature, the number of starts and issues warnings Read more about Intelligent position measuring system for absolute linear feedback[…]

Balluff at FachPack 2019

Balluff is once again at FachPack, the international trade show for packaging solutions (Sept. 24-26, 2019) in Nuremberg. With its portfolio for the packaging industry the global sensor specialist and supplier of automation solutions has the answers for the rapidly increasing demands on production with respect to productivity, flexibility and quality. Balluff sensors made of Read more about Balluff at FachPack 2019[…]

Lower costs with Balluff IO-Link sensor/actuator hubs

Shielded cables and interface cards result in high field installation costs. Help is here with IO-Link sensor/actuator hubs with M8 connectivity. New are an input module for 16 inputs and a configurable I/O module with 16 in-/outputs in an especially compact form factor. They feature a rugged IP67 metal housing for harsh conditions and an Read more about Lower costs with Balluff IO-Link sensor/actuator hubs[…]

Balluff UHF handheld reader – new generation

The UHF Handheld Reader BIS U-890 is an ideal tool for modern data collection. It offers great flexibility for RFID close range or in long-range applications. The reader is equipped with a powerful 1 GHz ARM processor and a 4.3" color touch screen. Together with Microsoft Windows Embedded Compact 7 it is designed especially for Read more about Balluff UHF handheld reader – new generation[…]

Photoelectric mini-sensors with background suppression

The series BOS Q08M and BOS R01E series photoelectric mini-sensors with their small, bright light spot are used for reliable object detection in many areas of application, especially where mounting space is at a premium. Through-beam, retroreflective and diffuse sensors have long been part of the Balluff portfolio. What’s new are versions with highly effective Read more about Photoelectric mini-sensors with background suppression[…]

Balluff 3D CAD product catalog wins award

Balluff GmbH, sensor specialist and provider of automation solutions, was recognized by CADENAS for their electronic product catalog based on the eCATALOGsolutions technology. The CADENAS "Golden Catalog Seal“, their highest award, is given to the components manufacturer with the most comprehensive intelligent engineering data and is considered as evidence for consistently high quality 3D-CAD catalogs. Read more about Balluff 3D CAD product catalog wins award[…]

An alliance for the IIoT

At the Hannover Messe 2019 trade fair, seven leading suppliers from mechanical engineering, industrial automation and software announced the foundation of the Open Industry 4.0 Alliance. With this cooperation, the companies want to overcome proprietary solutions and give a decisive boost to the digital transformation of the European industry. Founding members of the alliance are Read more about An alliance for the IIoT[…]