In a joint CogniCrypt transfer project, Fraunhofer IEM and achelos improve the quality for secure software implementation

Veracode published its new State of Software Security Report in January 2019. Producing this report involved analysing over two trillion lines of code over a full year. The results are alarming. More than 85 percent of all applications investigated display at least one weakness, many of which have been occurring for years and often affect Read more about In a joint CogniCrypt transfer project, Fraunhofer IEM and achelos improve the quality for secure software implementation[…]

Piezoelectric Micro Sensors based on aluminum nitride for Industrial Applications

Fraunhofer ENAS develops piezoelectric micro systems using aluminum nitride (AlN). These microsystems contain a high energy density which allows the miniaturization of MEMS and NEMS. Therefore, costs and energy consumption in the fabrication process of the microsystems can be reduced and the areas of application increases. In contrast to the common used lead zirconate titanate Read more about Piezoelectric Micro Sensors based on aluminum nitride for Industrial Applications[…]

Near field measurements with the NFS3000 for electromagnetic characterization of components and systems

As a result of the ever-increasing digitization, there is an enormous increase in electronic devices in the private, public and industrial sectors today. With the »Internet of Everything« and the resulting increase in interconnectivity, data from a wide variety of applications can be linked with each other, promising a gain in usable information. Three major Read more about Near field measurements with the NFS3000 for electromagnetic characterization of components and systems[…]

Thick Aluminum Layers for Assembly and Packaging Technology

Within a public funded project (AioLi BMBF-FKZ: 16ES0329K), the Fraunhofer ENAS developed a deposition process of thick aluminum layers on various substrates, like silicon, printed circuit board or ceramics. Due to the negative standard potential of aluminum, the electrodeposition is carried out in an ionic liquid instead of water-based electrolytes. With this method, it is Read more about Thick Aluminum Layers for Assembly and Packaging Technology[…]

Quality Control of 3D Printed Parts – Yxlon Technology Seminar at the Fraunhofer Institute in Dresden

Around 50 participants participated in the technology seminar on quality control of additive-manufactured (3D printed) parts which was organized by Yxlon and the Fraunhofer Institut für Werkstoff- und Strahltechnik (IWS) in Dresden on May 15 and 16. The seminar was fully booked. In the 14 presentations – held by the hosts and top-class speakers from Read more about Quality Control of 3D Printed Parts – Yxlon Technology Seminar at the Fraunhofer Institute in Dresden[…]

New E-Mobility & Circular Economy (EMCE 2019) conference will provide insight on how EVs will be recycled in the future

Critical sessions at the 2019 EMCE conference will focus on the present and future state of raw materials use in the design of new vehicles. EMCE 2019, organized by Switzerland-based ICM AG, is taking place from July 1-3 at the Westin Tokyo. Join speakers from Japan’s Harita Metal Co., Sweden-based Stena Recycling, JX Nippon Mining Read more about New E-Mobility & Circular Economy (EMCE 2019) conference will provide insight on how EVs will be recycled in the future[…]

VI-grade announces Official Review of 2019 International Conference

VI-grade, the leading provider of best-in-class products and services to bridge the gap between real world testing and technical simulation, today announced the official review of the 2019 edition of its International Conference. 242 engineers, managers, and simulation experts from over 100 automotive and transportation companies, universities and research centers gathered from 20 countries from Read more about VI-grade announces Official Review of 2019 International Conference[…]

New test rig components for faster development and validation

Numerical simulations have massively accelerated product development over the past few decades. A variety of scenarios can be tested in a short time and the number of necessary prototypes has been steadily reduced. Nevertheless, physical tests are widespread and will not lose significance over the next few decades. Numerical models must be validated and approval Read more about New test rig components for faster development and validation[…]

International conference in May celebrates 25th anniversary of LUM GmbH in Berlin

LUM GmbH is a leading international provider of innovative measurement technology for dispersion analysis and materials testing. Since the founding of the company by Prof. Dr. Dr. D. Lerche in 1994, LUM is also obliged to science. The company promotes science and technology and contributes by own research work to the further development of the Read more about International conference in May celebrates 25th anniversary of LUM GmbH in Berlin[…]

First Time – »Thomas Gessner Award« at SSI 2019 granted

At Smart Systems Integration Conference and Exhibition SSI 22019 for the first time the »Thomas Gessner Award« has been granted. The winner is Dr. Christian Huber, Robert Bosch GmbH Renningen. At Smart Systems Integration Conference and Exhibition SSI 22019 for the first time the »Thomas Gessner Award« has been granted. The winner is Dr. Christian Read more about First Time – »Thomas Gessner Award« at SSI 2019 granted[…]