Pixel-Plus combines data streams from multidimensional TOF ("time-of-flight") sensors with signals from high-resolution color cameras, creating digital representations of real objects. These "digital twins" offer a much higher level of information than solely camera- or sensor-based solutions. Together with the Linz Center of Mechatronics (LCM), an innovative digital approach to hydraulic sintering presses that will Read more about New to Industry 4.0[…]
. New 240 cpm former with a small footprint Availability with lock, glue or ultrasonic forming Integrated “Flex Feeder” ensures positive carton control Ergonomic low-level hopper for operator convenience On-board electrics replace control cabinet Syntegon Technology has launched its new Kliklok ACE (Advanced Carton Erector) carton former platform at its virtual show booth. Visitors could Read more about Syntegon Technology launches Kliklok ACE carton former[…]
Qualcomm Technologies, Inc. and BOE Technology Group Co., Ltd., a global leader in the semiconductor display industry, announce their plans to establish a strategic collaboration to develop innovative display products featuring Qualcomm® 3D Sonic ultrasonic fingerprint sensors. This collaboration is expected to extend from mobile and associated 5G technologies to XR and IoT. Qualcomm Technologies’ Read more about Qualcomm and BOE Announce Collaboration to Develop Innovative Display Products Featuring Qualcomm 3D Sonic Sensors[…]
In order to counter the spread of the corona virus, the owner-managed company has taken a number of actions to prevent the virus from being dispersed. The management continuously monitors the developments with regard to the spread of COVID-19 and reevalutate the current situation on a daily basis. "Above all, the health and safety of Read more about SONOTEC® – „We are continuing our operations and are fully available for our customers.“[…]
SONOTEC has established itself over the past 25 years in the global NDT market as a specialist for customized ultrasonic testing solutions. With a powerful R&D team and a state-of-the-art in-house piezo-composite production, the company accompanies its customers from the first product to idea to serial production. Expert for ultrasonic applications Being an expert in Read more about Customized transducers for ultrasonic NDT – Made in Germany[…]
The futuristic company soniKKs® GmbH has specialized in the development of customized ultrasonic devices and components. Continuous advancements and innovations are especially important to the business located in the black forest town Dobel. From Customized Development to Series Production Thanks to continual research and cooperations with universities and colleges as well as research facilities soniKKs® Read more about soniKKs® Focuses on Progress[…]
The core competence of PFAFF Industriesysteme und Maschinen GmbH is the joining of flexible materials. The company not only masters industrial sewing applications, but has also been an innovation leader in textile welding applications for decades. Depending on the material and customer requirements, customer solutions are implemented using the ULTRASONIC, HOT-AIR or HOT WEDGE welding Read more about Production units with latest joining technologies for the filtration industry[…]
Within the industrial area ultrasonic has become a very popular instrument to professionally realize a variety of applications. For this reason, soniKKs® Ultrasonics Technology GmbH specializes in development and production of high-quality ultrasonic devices. The company offers, among other products, ultrasonic generators for any application. Individualized Customer Solutions on Request The wide range of soniKKs® Read more about soniKKs® Ultrasonic Generators Suitable for Any Application[…]
The new SCANIUS-LINE combines long travel with the accuracy of a piezo drive in a compact design. Fast – moving speed up to 160 mm/s Precise – resolution down to 40 nm Flexible – travel range of up to 150 mm and higher Compact – only 35 mm flat Piezosystem jena presents the new product Read more about SCANIUS-LINE: Moving into a new direction[…]
Within a public funded project (AioLi BMBF-FKZ: 16ES0329K), the Fraunhofer ENAS developed a deposition process of thick aluminum layers on various substrates, like silicon, printed circuit board or ceramics. Due to the negative standard potential of aluminum, the electrodeposition is carried out in an ionic liquid instead of water-based electrolytes. With this method, it is Read more about Thick Aluminum Layers for Assembly and Packaging Technology[…]