Comprehensive optical wafer testing for μLEDs at a single test station

Instrument Systems offers a unique camera-based measurement solution for μLED wafer testing that generates 2-dimensional, pixel-resolved optical analyses within given cycle times. The LumiTop 4000 has a resolution of 12 MP and can detect the smallest of defects and inhomogeneities on the wafer. Thanks to a 100 mm macro lens, the camera enables fast parallel Read more about Comprehensive optical wafer testing for μLEDs at a single test station[…]

Advantest’s New TS9001 Time Domain Reflectometry (TDR) System Employs Terahertz Technology to Provide High Resolution Analysis of Circuit Faults

Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) announced today that it has initiated sales of its new TS9001 TDR System. The new system fully utilizes the company’s unique terahertz technology to enable non-destructive and high-resolution analysis on circuit faults in advanced semiconductor packages, such as flip chip BGAs, wafer level packages, and 2.5D/3D Read more about Advantest’s New TS9001 Time Domain Reflectometry (TDR) System Employs Terahertz Technology to Provide High Resolution Analysis of Circuit Faults[…]

Solarius Europe Delivers Optical 3D Inspection to Experts for Inhalation Systems

In February 2020 already, a 3D wafer inspection system of the new Solarius SIMP process platform was delivered to the German MedTech innovator Boehringer Ingelheim microParts. After the delivery was completed, the tool now is ready for the final validation of productive use. Following the installation of a SECS/GEM integrated 300 millimeter wafer inspection system Read more about Solarius Europe Delivers Optical 3D Inspection to Experts for Inhalation Systems[…]

Gentle and effective ultrasonic cleaning for sensitive substrates

Sensitive components such as monocrystalline wafers from the photovoltaic and semiconductor industries as well as optical lenses and prisms and super-finely structured substrates place tough demands on component cleaning: The tiniest of contamination must be reliably removed without compromising the surface. For these demanding cleaning tasks, Weber Ultrasonics has developed the intelligent SonoPower 3S megasound Read more about Gentle and effective ultrasonic cleaning for sensitive substrates[…]

Mapping Sensor from Balluff– Precision in the smallest possible space

For wafer mapping Balluff offers a highly precise photoelectric sensor which integrates perfectly into the end effectors. Especially designed for extremely thin end effectors, the compact BOH TI-R002 mapping sensor features an extremely controlled and focused light spot with outstanding homogeneity. It offers the highest precision in the smallest possible space, reliably detecting the edges Read more about Mapping Sensor from Balluff– Precision in the smallest possible space[…]

Solarius Deliveres 300 Millimeter Wafer Inspection to Taiwan

Already on May 21, 2019, the Solarius Group received another strategically important order from a top 3 semiconductor foundry for the optical inspection of wafers. Under the terms of the contract, Solarius Europe will supply a fully automated 300 mm wafer inspection system for the manufacture of complex wafer-based optical elements according to international hardware Read more about Solarius Deliveres 300 Millimeter Wafer Inspection to Taiwan[…]

Thick Aluminum Layers for Assembly and Packaging Technology

Within a public funded project (AioLi BMBF-FKZ: 16ES0329K), the Fraunhofer ENAS developed a deposition process of thick aluminum layers on various substrates, like silicon, printed circuit board or ceramics. Due to the negative standard potential of aluminum, the electrodeposition is carried out in an ionic liquid instead of water-based electrolytes. With this method, it is Read more about Thick Aluminum Layers for Assembly and Packaging Technology[…]

LumaSense introduces the m920 Series Semiconductor OEM module

LumaSense Technologies, Inc. introduces the m924 (4-channel) and m922 (2-channel) Semiconductor OEM Modules, designed for Electrostatic Chuck, Chamber, and other device temperature monitoring during Etching and Wafer Fabrication processes. The LumaSense solution provides advanced and reliable temperature monitoring up to 330 °C. The new m924 Semiconductor OEM module sampling rate is five times faster than Read more about LumaSense introduces the m920 Series Semiconductor OEM module[…]