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Month: October 2018

White paper on battery technologies for safe and durable DC UPS systems

Posted on 26. October 201830. October 2018 by Firma Bicker Elektronik Posted in Electrical Engineering Tagged battery, bicker, bms, cell, cells, charging, cobalt, energy, iron, mobile, power, storage, upsi, usv, with

Bicker Elektronik (Donauwoerth/Germany) publishes a white paper titled "Selecting the right battery technology for long-lasting and safe DC UPS systems". The fail-safe availability of process-relevant systems and components begins quite fundamentally with the uninterruptible power supply (UPS) and the associated […]

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E-series SPXOs offer ultra-low jitter

Posted on 26. October 20183. August 2020 by Firma Epson Europe Electronics Posted in Hardware Tagged electronics, epson, epson's, gbps, hff, inkjet, optical, power, ppm, printing, robotics, robots, series, voltage, with

Epson Europe Electronics GmbH (“Epson”) presents the E-Series SPXO. Designed for high-performance networking applications, Epson’s E-series SPXOs covering a frequency range of 25-200 MHz feature ultra-low jitter to deliver wide-open eye diagrams for high-speed (up to 400 Gbps) optical and […]

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Aurubis orders three new Peirce-Smith converters from SMS group

Posted on 26. October 201825. November 2022 by Firma SMS group Posted in Industrial Engineering Tagged aurubis, based, blister, converter, converters, copper, design, future, Hamburg, new, process, production, sms, they, with

Hamburg-based Aurubis AG is to take delivery of three new converters, which will be supplied by SMS group (www.sms-group.com) and used to produce blister copper, an important stage in the copper production process. The converters will be installed at the […]

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Continuous process monitoring and FE simulation for automated 3D fiber layup

Posted on 26. October 201813. April 2020 by Firma Cevotec Posted in Industrial Engineering Tagged ARTIST STUDIO plugin for HyperMesh, automated 3D fiber layup, CAE-software, cevotec, continuous process monitoring, FE simulation, fiber patch placement, integrated sensors, SAMBA Multi, vision system

As a result of constantly enhancing and extending the Fiber Patch Placement technology, Cevotec currently announced the latest developments particularly for the requirements of the aerospace industry. Now the specialists focus on continuous process monitoring and FE simulation for automated […]

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Industrial computers, touch panels and a new AI computer

Posted on 26. October 2018 by Firma Syslogic Posted in Hardware Tagged arm, cactus, embedded, gpu, intel, learning, lte, market, new, nvidia, processor, production, syslogic, tegra, with

At the end of November, the SPS IPC Drives trade show will once again be held in Nuremberg. This event will feature the “embedded systems” specialist Syslogic showcasing its portfolio of industrial PCs and touch panels as well as a […]

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Apium launches new materials

Posted on 26. October 201829. November 2019 by Firma Apium Additive Technologies Posted in General Tagged 3D printing, additive manufacturing, apium, gas, industrial 3d printing, industry, Material Extrusion, materials, new materials, oil, peek, polypropylene, pom-c, pp, pp 3d printing, pvdf

To leverage on Innovation, industries rely on materials and processing technologies. At Apium we recognize this task thus have meticulously kept working on our advanced Material Extrusion (FFF) 3D printing technology to ensure that industries can innovate. With the launch […]

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The new StepOver duraSign Pad 10.0 signature pad

Posted on 26. October 201811. January 2022 by Firma StepOver Posted in Hardware Tagged 10 zoll, cash Registers, counters, durable, electronic signature, handwritten electronic signature, offline signature solution, online signature solution, pen pads, PenPads, Point of sale, secure, secure signing, Signatur Pads, Signature pads, signature Software, signature solution, stationary use, stepover, u-pads

StepOver takes extreme pride in launching the new StepOver duraSign Pad 10.0 signature pad which takes a step forward in expanding our product portfolio. The new duraSign Pad 10.0 signature pad is the second product developed in the "duraSign Pad […]

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Shandong Rizhao grants SMS group FAC for high-capacity hot strip mill

Posted on 25. October 201825. November 2022 by Firma SMS group Posted in Industrial Engineering Tagged china, contour, crown, energy, heat, iron, mill, new, pickling, production, rizhao, sms, steel, tcm, with

Chinese steel producer Shandong Iron & Steel Rizhao has issued the Final Acceptance Certificate for the new high-capacity hot strip only seven months after rolling the first coil. The hot strip mill is part of a large-scale order which the […]

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Smart Construction Equipment on the rise

Posted on 25. October 201812. December 2018 by Firma VDI Wissensforum Posted in Events Tagged caterpillar, drones, fraunhofer, hochtief, learning, neuson, new, palfinger, printing, smart, topcon, vdi, volvo, wacker, zeppelin

Digitalization, automation and big data are the top three challenges the construction industry is facing. The 2nd international VDI conference Smart Construction Equipment, held in Amsterdam on 4 and 5 December 2018, provides information on the effects and opportunities of […]

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ArcelorMittal showcases innovations and its leading role in the ResponsibleSteel™ initiative at Euroblech 2018

Posted on 24. October 20187. October 2020 by Firma ArcelorMittal Germany Holding Posted in General Tagged amstrong, arcelormittal, coating, euroblech, flat, machine, market, new, production, responsiblesteel, solar, steel, vacuum, water, with

ArcelorMittal will present five of its leading flat product steel innovations at this year’s Euroblech, the world’s largest exhibition for the sheet metal working industry. The exhibition takes place in Hanover from October 23 to 26 2018. ArcelorMittal innovations on […]

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