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Author: Firma ASMPT

ASMPT Announces 2022 Annual Results

Posted on 1. March 202325. October 2024 by Firma ASMPT Posted in General Tagged asmpt, bps, dividend, foundry, hpc, idm, laser, market, micro, micron, packaging, printing, revenue, statements, with

ASMPT Limited (“ASMPT” / the “Group”/ the “Company”) (Stock code: 0522), a leading global provider of hardware and software solutions for the manufacture of semiconductors and electronics, announced its annual results for the year ended 31 December 2022. The Group […]

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Openautomation, novel software, and new printplatform draw record crowd

Posted on 14. February 202325. October 2024 by Firma ASMPT Posted in General Tagged analytics, apex, asmpt, asmpts, DEK, market, mdc, mes, new, printing, production, siplace, smt, stencil, with

ASMPT today announced that last month’s IPC APEX EXPO event in San Diego was among its most successful, as a record number of attendees visited the automation leader’s exhibit. With attendance back to pre-pandemic levels, ASMPT credits its new data […]

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ASM Pacific Technology Reaches Milestone with 250th Thermo-Compression Bonding Tool Shipped to Customers

Posted on 3. March 202125. October 2024 by Firma ASMPT Posted in General Tagged asm, asmpt, asmpts, bonder, cis, cuf, market, new, packaging, privileged, semiconductor, tcb, thermo, wafer, with

ASM Pacific Technology (ASMPT), a leading global supplier of hardware and software solutions for the manufacturing of semiconductors and electronics, announced that it has shipped its 250th Thermo-Compression Bonding (TCB) tool to customers in Feb 2021. This milestone highlights ASMPT’s […]

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ASMPT Announces 2020 Third Quarter Results

Posted on 30. October 202025. October 2024 by Firma ASMPT Posted in General Tagged asm, asmpt, asmpts, bps, cis, hpc, lighting, market, micro, mini, packaging, production, revenue, with, yoy

ASM Pacific Technology Limited (“ASMPT”, “the Group”) (Stock Code: 0522) announced its results for the third quarter and the nine months ended 30 September 2020. ASMPT is a leading global supplier of hardware and software solutions in the manufacturing of […]

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Successful Nepcon Asia 2020

Posted on 14. September 202025. October 2024 by Firma ASMPT Posted in General Tagged adamos, aiv, ams, asm, hermes, m2m, market, micron, oppo, packaging, printing, processexpert, siplace, stencil, with

The 2020 Nepcon Asia trade fair in Shenzhen, China was again a big success for technology leader ASM. The live shows in the Integrated Smart Factory Arena with AIV-supported automatic material logistic and changeovers, which have been developed together with […]

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