Press releases worldwide
ASMPT (HKEX: 0522), a leading global supplier of hardware and software solutions for semiconductor and electronics manufacturing, announced that its Board has concluded that retaining the SMT Solutions Segment as part of the ASMPT Group is in the best interests […]
ASMPT (HKEX: 0522), the world’s leading provider of integrated hardware and software solutions for semiconductor and electronics manufacturing, today announced that Bassel Haddad has assumed the roles of Group Chief Executive Officer and Executive Director. The leadership transition, first announced […]
ASMPT (HKEX: 0522), the world’s leading provider of integrated hardware and software solutions for semiconductor and electronics manufacturing, announced it had won new orders for 19 Chip-to-Substrate (C2S) TCB tools from a major OSAT partner of the leading foundry serving […]
ASMPT Ltd (“the Group”), the world’s leading provider of integrated hardware and software solutions for semiconductor and electronics manufacturing, announced that Ms Katie Xu Yifan will be promoted to Executive Vice President and Group Chief Financial Officer, effective Dec 1. […]
In a significant step towards accelerating readiness for the Tata Electronics semiconductor assembly and test facilities in Vemagal, Karnataka and Jagiroad, Assam, Tata Electronics (a wholly-owned subsidiary of Tata Sons Pvt. Ltd.) signed a Memorandum of Understanding (MOU) with ASMPT […]
ASMPT Limited will exhibit trendsetting semiconductor assembly and packaging equipment at SEMICON India 2024, Greater Noida, September 11 – 13, 2024, IEML, Booth H1V01. The trade fair, coinciding with electronica and productronica India, is regarded as the most important meeting […]
ASMPT Limited, the world’s leading provider of hardware and software solutions for the semiconductor and electronics industries, will be exhibiting at SEMICON Taiwan 2024, Asia’s leading electronics manufacturing event, from 4-6 September. ASMPT will showcase its advanced systems, NUCLEUS XLplus, […]
ASMPT and IBM today announced a renewed agreement to extend their collaboration on the joint development of the next advancement of chiplet packaging technologies. Through the agreement, the two companies will work together to advance thermocompression and hybrid bonding technology […]
With its innovative, data-driven Intelligent Factory concept and a comprehensive hardware and software portfolio around SMT production, market and innovation leader ASMPT will be a major presence at the IPC APEX EXPO 2024, the industry’s main event in California. At […]