Firma congatec, Autor bei PR-Web

Plates-formes à gamme de température étendue pour l’informatique de périphérie – du COM-HPC haut de gamme au SMARC basse consommation

Posted on 11. March 20219. March 2022 by Firma congatec Posted in Hardware Tagged cas, conga, congatec, est, hpc, imx, intel, les, offshore, processeurs, qseven, smarc, tc570, tsn, une

congatec – un des principaux fournisseurs de technologie informatique embarquée et de périphérie – se concentre sur les défis de robustesse des clients lors de l’Embedded World 2021 virtuel, en présentant des plates-formes à plage de température étendue pour tous […]

Embedded at the edge and in the fog

Posted on 11. November 20209. March 2022 by Firma congatec Posted in Hardware Tagged anomaly, bsi, closures, cloud, congatec, embedded, energy, hpc, iot, market, pyramid, robotics, security, smart, with

congatec is expanding its embedded and edge computing solution platform offering to include the new market of rugged fog computer technologies. Used in various industrial as well as critical network applications, rugged fog computers reside in the network computing and […]

Hot stuff for extreme temperatures

Posted on 11. November 20209. March 2022 by Firma congatec Posted in Hardware Tagged ambulance, conga, congatec, defender, energy, fpga, hpc, intel, linux, security, storage, tc570, tsn, uhd, with

congatec – a leading vendor of embedded and edge computing technology – introduces six new Computer-on-Modules with 11th Gen Intel Core processors for the extended temperature range. Built with high-quality components designed to withstand extreme temperatures from -40 to +85°C, […]

Real-time operation over broadband

Posted on 11. November 20209. March 2022 by Firma congatec Posted in Hardware Tagged broadband, congatec, dds, embedded, intel, networks, opc, orchestra, pyramid, safeguard, tcc, tsc, tsn, with, x6000e

congatec – a leading vendor of embedded and edge computing technology – introduces new application-ready platforms for tactile internet applications over public broadband as well as private IP networks. They support Time Sensitive Networking (TSN) in combination with the new […]

Important milestone for the COM-HPC integration

Posted on 11. November 20209. March 2022 by Firma congatec Posted in Hardware Tagged broadband, conga, congatec, embedded, express, hcp, hpc, intel, mipi, pcie, server, switch, tpd, usb, with

congatec – a leading vendor of embedded and edge computing technology – introduces the first carrier board and cooling solutions building the foundation of the new ecosystem for the brand new PICMG COM-HPC standard. They are a major milestone for […]

Massively more power on much smaller footprint

Posted on 11. November 20209. March 2022 by Firma congatec Posted in Hardware Tagged amd, amey, conga, congatec, EMB, energy, microsoft, radeon, river, rsa, Ryzen, security, tcv2, wind, with

congatec – a leading vendor of embedded and edge computing technology – significantly broadens the application areas of its AMD Ryzen Embedded processor based COM Express Type 6 platforms towards smaller but more powerful system designs by premiering the brand […]

New state-of-the-art Computer-on-Modules

Posted on 23. September 20209. March 2022 by Firma congatec Posted in Hardware Tagged conga, congatec, defender, embedded, hpc, inference, intel, iot, linux, robotics, signage, storage, tc570, tsn, with

congatec – a leading vendor of embedded and edge computing technologies – announces launch of 12 brand new Computer-on-Modules in parallel with today’s Intel IOTG (Internet of Things Group) launch of the 11th Gen Intel Core processors. Based on the […]

Whopping 50% more edge computing power

Posted on 23. September 20209. March 2022 by Firma congatec Posted in Hardware Tagged congatec, energy, gaming, ic18, intel, iot, microsoft, pico, qseven, security, smarc, storage, tsn, with, x6000e

congatec – a leading vendor of embedded computing technology – welcomes the launch of Intel’s new low-power processor generation on five embedded form factors. To be made available on SMARC, Qseven, COM Express Compact and Mini Computer-on-Modules as well as […]

Premier COM-HPC et nouvelle génération COM Express

Posted on 3. September 20209. March 2022 by Firma congatec Posted in Hardware Tagged cloud, conga, congatec, embarquée, est, hdr, hpc, intel, les, processeurs, sont, taux, tc570, thunderbolt, une

Parallèlement au lancement de la 11e génération de processeurs Intel Core (nom de code Tiger Lake), congatec – un des principaux fournisseurs de technologie informatique embarquée – annonce la disponibilité de son premier module COM-HPC Client de taille A et […]

First COM-HPC and next-gen COM Express

Posted on 3. September 20209. March 2022 by Firma congatec Posted in Hardware Tagged cloud, conga, congatec, congatecs, embedded, energy, express, hdr, hpc, intel, linux, power, tc570, thunderbolt, with

In parallel with the 11th Gen Intel Core processor launch (code named “Tiger Lake”), congatec – a leading vendor of embedded computing technology – announces the availability of both its first COM-HPC Client size A module and a next generation […]