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Author: Firma congatec

congatec and EFCO strengthen partnership for customized embedded systems in APAC

Posted on 20. August 2026 by Firma congatec Posted in Hardware Tagged computing, cost efficiency, customized, deployment speed, edge, embedded, interoperability, Lifecycle Management, localization, manufacturability, platform strategy, Reference Design, ruggedization, scalability, system solutions

congatec – a leading provider of embedded and edge computing technology – today announced at Automation Taipei the expansion of its aReady.YOURS Partner Program through a strategic partnership with Taiwan-based EFCO Technology. The focus is to deliver application-specific, customized system […]

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High-Performance Module for Physical AI Applications at the Rugged Edge

Posted on 24. July 2026 by Firma congatec Posted in Hardware Tagged AI accelerator cards, AMD Ryzen AI Embedded X100 Series processors, COM-HPC Client Size C module, cybersecurity compliance, edge inference, GPGPU computing, industrial Ethernet, industrial temperatures, low total cost of ownership, physical AI applications, Real Time Control, robotics, ruggedized design, sensor fusion, virtualized workloads

congatec – a leading provider of embedded and edge computing technology – today introduced its new COM-HPC Client Size C module with AMD Ryzen™ AI Embedded X100 Series processors. The application-ready aReady.COM conga-HPC/cRX1 has been specifically designed for compute-intensive physical […]

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congatec hypervisor and CODESYS PLC: streamlining mixed-critical workload consolidation

Posted on 30. June 2026 by Firma congatec Posted in General Tagged automation virtualization, codesys, congatec, deterministic performance, edge computing, hypervisor, IEC 61131-3, machine-builders, mixed-criticality, plant automation, PLC, runtime system, secure isolation, standard hardware, virtualization

congatec – a leading vendor of embedded and edge computing technology – and CODESYS Group – a market leader in hardware-independent control software – today announced the initiation of a strategic cooperation. This new partnership is set to deliver highly […]

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Accelerating application-ready edge AI

Posted on 23. June 2026 by Firma congatec Posted in Hardware Tagged AI-enabled applications, application-ready, customization services, edge ai, electronics manufacturing, Embedded Computing, hybrid systems, industrial computing, industrial digitalization, inference acceleration, prototype-to-production, regional deployment, semiconductor ecosystem, Strategic Partnership, tech stacks

congatec – a leading vendor of embedded and edge computing technology – and ECTrons Sdn. Bhd. – a Penang-based embedded computing specialist – entered into a strategic partnership for the development and commercialization of AI-powered industrial computing solutions. The agreement […]

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Certified processes for development of cyber-secure embedded applications

Posted on 9. June 2026 by Firma congatec Posted in Security Tagged Automatisierungsindustrie, cybersecurity, embedded, Energiebranche, IEC 62443-4-1, Informationssicherheit, Lieferkettensicherheit, Medizintechnik, Produktzertifizierung, Risikomanagement, Robotertechnik, Sicherheitsnachweise, support, Systemintegratoren, zertifizierung

congatec – a leading provider of embedded and edge computing technology – has been certified to IEC 62443-4-1:2018 for the development and support of its embedded building blocks and tech stacks. With the certification issued by TÜV NORD, customers using […]

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Extraordinary AI performance from -40 to +85 °C for rugged applications

Posted on 31. March 2026 by Firma congatec Posted in Hardware Tagged COM Express, COM-HPC, computer on modules, industrial temperature range, Intel Core Ultra Series 3, Intel Panther Lake, rugged embedded systems

congatec – a leading vendor of embedded and edge computing building blocks – is expanding its portfolio of Computer-on-Modules (COMs) with Intel Core Ultra Series 3 processors to include variants for the extended industrial temperature range of -40 °C to […]

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aReady.COM conga-SMX95 optimizes time-to-market and expands usage potential

Posted on 12. March 202617. March 2026 by Firma congatec Posted in Hardware Tagged application-ready solutions, aReady.COM, arm, computer on modules, congatec, development cycles, Embedded Computing, industrial applications, manufacturing efficiency, NXP Semiconductors, real-time computing, smarc, System-Integration

congatec – the leading provider of embedded and edge computing technology – is extending its portfolio of application-ready aReady. software building blocks to include Arm-based Computer-on-Modules. The first product in this expansion is the successful SMARC module conga-SMX95, based on […]

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congatec and Kontron partner on embedded computing solutions

Posted on 11. March 202616. March 2026 by Firma congatec Posted in Hardware Tagged Agility, aReady.YOURS, automation, computing, congatec, embedded, innovation, integration, iot, modular, regulatory, solutions, systems, technology, turnkey

congatec – the leading provider of embedded and edge computing technology – is expanding its portfolio of customized embedded computing platforms. With the launch of the aReady.YOURS Partner Program, the company is strengthening its ability to deliver added value to […]

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conga-TCRP1 combines high performance with maximum scalability and design flexibility

Posted on 11. March 202616. March 2026 by Firma congatec Posted in Hardware Tagged AI applications, amd, conga-TCRP1, edge computing, embedded systems, high performance computing, performance, performance optimization, real-time workloads, Ryzen AI P100, scalability, scalable architecture

congatec – the leading vendor of embedded and edge computing technology – is enhancing the performance and scalability of its AMD Ryzen™ AI Embedded P100 Series COM Express 3.1 Type 6 Compact modules. The conga-TCRP1 is now available in six new variants with […]

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aReady.YOURS from congatec for fast and reliable (full) custom embedded computing designs

Posted on 11. March 202616. March 2026 by Firma congatec Posted in Hardware Tagged application, computer on modules, computing, Cooling, design, embedded, embedded design, engineering, full custom designs, integration, manufacturing, partnership, services, solution, turnkey

congatec – the leading provider of embedded and edge computing technology – today announced its new Customer Application Center and the launch of aReady.YOURS. With this move, congatec expands its aReady. hardware and software building blocks portfolio to include comprehensive customization design […]

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