Skip to content

PR-Web

Press releases worldwide

  • Home
  • Contact
  • Datenschutzerklärung
  • Legal notice

Author: Firma FINETECH

Adhesive bonding solutions for automated assembly of industrial LCD display systems

Posted on 10. November 202025. January 2021 by Firma FINETECH Posted in General Tagged acp, aditech, bonder, finetech, lab, machine, micro, micron, new, packaging, production, project, research, sigma, with

Finetech ensures information flows right on time: Aditech’s modern LCD Displays for transportation and industrial applications are manufactured on a FINEPLACER® system. Every minute, thousands of people rush through train stations, looking for their track or confirmation that the train is on time. […]

Read More

Brain Implant Gives New Hope to Epileptics

Posted on 10. November 202025. January 2021 by Firma FINETECH Posted in General Tagged brain, cando, cells, dynamics, fineplacer, finetech, gold, implant, implants, micro, micron, patients, sharp, soldering, with

The British CANDO project develops brain implants for epileptics which could actively avoid life-threatening seizures. Measuring only a few micrometers, the implants are assembled with a FINEPLACER® high-precision die bonder. In the brain, nerve cells generate rhythmic activity or ‘brain waves’. […]

Read More

The Core of Highly Flexible Rework

Posted on 10. November 202025. January 2021 by Firma FINETECH Posted in General Tagged energy, finetech, heat, infrared, ive, machine, market, medical, mobile, modules, production, semiconductor, siemens, solder, with

Around the globe, Siemens locations rely on Finetech systems for rework of electronic components and high-accuracy semiconductor assembly. One of them is the long-established production site in Fürth Hardhöhe, Germany. For decades, this Siemens facility has been producing electronic components, […]

Read More

Stanford Nanofabrication Facility Partners with Finetech on Die Bonding Technologies

Posted on 19. September 201825. January 2021 by Firma FINETECH Posted in Industrial Engineering Tagged bonder, finetech, honor, lab, labs, machine, mems, micro, micron, packaging, research, silicon, students, usha, with

Finetech, a global supplier of micro-assembly equipment, is pleased to have recently formed a partnership with the Stanford Nanofabrication Facility (SNF) located in the newly opened Paul. G Allen Building in Stanford, California.  The FINEPLACER® Lambda, a flexible sub-micron die bonder for precision die […]

Read More

Universal Instruments Installs Finetech Multipurpose Bonder in its Advanced Process Laboratory

Posted on 7. July 201725. January 2021 by Firma FINETECH Posted in Industrial Engineering Tagged adhesive, bonder, conklin, copper, finetech, micro, new, packaging, pico, pillar, power, research, silver, soldering, with

Finetech and Universal Instruments announce the addition of a FINEPLACER® pico bonding system to the Universal Instruments Advanced Process Laboratory. The Universal Advanced Process Laboratory (APL) in Conklin, New York, offers comprehensive electronic assembly process research, advanced assembly services and supporting […]

Read More

Posts navigation

Newer posts

Copyright 2016. All rights reserved.


Back To Top
We use cookies to ensure that we give you the best experience on our website. If you continue to use this site we will assume that you are happy with it.OkRead more