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Month: March 2019

EBV Elektronik, RoodMicrotech and Fraunhofer Institute for Integrated Circuits Announce Cooperation

Posted on 4. March 2019 by Firma EBV Elektronik GmbH & Co KG (An Avnet Company) Posted in General Tagged am1, battery, ebv, ebvchips, embedded, fraunhofer, iot, market, micros, networks, new, power, production, roodmicrotec, with

EBV Elektronik, an Avnet company (Nasdaq: AVT), RoodMicrotec and Fraunhofer Institute for Integrated Circuits IIS announce their cooperation in the production and marketing of Fraunhofer IIS ready-to-use chip IP. Since last year’s embedded world, EBV has been working on its EBVchips […]

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Now with UL and CSA approval

Posted on 4. March 201918. May 2020 by Firma bender Posted in Electrical Engineering Tagged cd440, Frequency monitoring devices, measuring instruments, nominal system voltages, power generation systems, vmd461

To ensure electrical safety for man and machine, the operating states of electrical installations must be monitored continuously. Since electrical parameters such as voltage and frequency are not visible to the naked eye, this means that suitable measuring instruments need […]

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Automated multi-material fiber placement by Cevotec at JEC World 2019

Posted on 4. March 201913. April 2020 by Firma Cevotec Posted in Industrial Engineering Tagged cevotec, fiber patch placement, ifs, jec world 2019, multimaterial-components, safran nacelles, SAMBA Multi, sandwich structures

SAMBA goes multi-material: At JEC World 2019 Cevotec presents latest Fiber Patch Placement developments. Featuring a multi-material feeding unit, SAMBA Multi production cells automate the time- and cost-intensive multi-material lay-up of aerospace sandwich components. Up to now, manufacturing multi-material components […]

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Innovative RaAxial fan

Posted on 4. March 2019 by Firma SEPA EUROPE Posted in Electrical Engineering Tagged Axial Fan, Blower, customized cooling solutions, fans, Heat Sink, Kühligel, LED cooling, MagFix, micro fan, Radial Fan, SEPA EUROPE, Thermal Management

The fan and cooling specialist SEPA EUROPE unveils a true innovation this year: The RaAxial fan. This created term is a combination of the words radial and axial. The microfan with its dimensions of 17x17x4.5mm is ideal for compact, embedded applications […]

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New: high-voltage inserts for the ODU MEDI-SNAP®

Posted on 4. March 20199. February 2024 by Firma ODU Posted in Electrical Engineering Tagged connector, design, high voltage, hot-plugging, iec 60664-1, inserts, mating, new, odu, odu medi-snap, snap, space, switch, they, trade, with

All new, high-voltage inserts for the ODU MEDI-SNAP® are enabling the reliable transmission of up to 1,000V AC / 16A according to IEC 60664-1. Further they are capable of preventing “hot plugging” by featuring a special pin-layout design with lagging […]

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congatec premieres with 40% performance boost

Posted on 1. March 20199. March 2022 by Firma congatec Posted in Hardware Tagged camera, conga, congatec, embedded, intel, jc370, market, micro, mobile, new, power, tsn, uhd, usb, with

congatec – a leading vendor of standardized and customized embedded computer boards and modules – enters the 3.5 inch single board computer (SBC) business with a 40% performance boost for existing applications. To achieve this impressive performance increase, the new […]

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Besuchen Sie uns auf Nordbau 2019! (Messe | Neumünster)

Posted on 1. March 2019 by Firma SITECH Deutschland Posted in Events

Nordbau 2019 Neumünster11.09. – 15.09.19 Zur Webseite der Veranstaltung » Eventdatum: 11.09.19 – 15.09.19 Eventort: Neumünster Firmenkontakt und Herausgeber der Eventbeschreibung: SITECH Deutschland GmbHZum Aquarium 6a46047 OberhausenTelefon: +49 (208) 302137-0Telefax: +49 (208) 302137-25http://www.sitech.de Weiterführende Links Originalinserat von SITECH Deutschland GmbH Alle […]

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Besuchen Sie uns auf bauma 2019! (Messe | München)

Posted on 1. March 2019 by Firma SITECH Deutschland Posted in Events

bauma 2019 München08. – 14.04.19Halle A2, Stand 437 Vereinbaren Sie einen Termin »Zur Webseite der Veranstaltung » Eventdatum: 08.04.19 – 14.04.19 Eventort: München Firmenkontakt und Herausgeber der Eventbeschreibung: SITECH Deutschland GmbHZum Aquarium 6a46047 OberhausenTelefon: +49 (208) 302137-0Telefax: +49 (208) 302137-25http://www.sitech.de Weiterführende Links […]

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Performance boost for rugged edge computing markets

Posted on 1. March 20199. March 2022 by Firma congatec Posted in Hardware Tagged amd, b7e3, cells, conga, congatec, epyc, hpc, linux, microsoft, nvme, security, storage, virtualization, vpn, with

congatec – a leading vendor of standardized and customized embedded computer boards and modules – introduces its first Server-on-Module with AMD embedded processors. The new conga-B7E3 Server-on-Module with the AMD EPYC Embedded 3000 processor is currently the cutting edge of […]

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TANK-870AI – AIoT Developer Kit

Posted on 1. March 2019 by Firma ICP Deutschland Posted in Hardware Tagged ai, arduino, artificial intelligence, cloud, Deep learning, fpga, icp, inference, intel, iot, KI, learning, new, pcie, ssd, storage, vpu, with, xeon

Deep Learning consists of the sub-areas training and inference. In the training phase, a training model is developed, tested and refined to the desired accuracy using a comprehensive dataset of images and videos. While in the inference phase a rapid […]

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