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Author: Firma LayTec

Supervisory Board extends contracts ahead of time for Volker

Posted on 4. May 20235. May 2023 by Firma LayTec Posted in General Tagged applications, blank, board, customers, development, future, laytec, new, product, quality, solutions, supervisory, they, trust, with

The Supervisory Board of LayTec AG has extended the contracts of the two members of the Managing Board ahead of schedule: Volker Blank and Dr. Kolja Haberland were appointed for additional five years to continue in their current role. This […]

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LayTec to present its new EpiX cassette-to-cassette (C2C) mapping station at ICMOVPE XX in Stuttgart, Germany

Posted on 7. July 2022 by Firma LayTec Posted in General Tagged applications, cassette, epix, icmovpe, inspection, laytec, laytecs, light, market, metrology, new, seminar, wafer, with, zettler

After introducing its EpiX mapping station some years ago, LayTec is now bringing its newest EpiX generation to the market. The first demo unit of this novel metrology system will be displayed at LayTec‘s booth at ICMOVPE XX in Stuttgart, […]

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Knowledge and Power: Oxford Instruments Plasma Technology and LayTec join forces to provide critical front end processing solutions for the production of compound semiconductor devices

Posted on 7. April 20217. April 2021 by Firma LayTec Posted in Research / Development Tagged etch, gan, inp, iot, laytec, laytecs, market, metrology, new, optical, power, semiconductor, sic, thin, with

Two technology leaders within the compound semiconductor industry, Oxford Instruments Plasma Technology and LayTec announce an exclusive collaboration agreement to enable the next generation requirements of advanced semiconductor devices in the high-volume manufacturing (HVM) environment. The partnership aims to develop […]

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