Press releases worldwide
Booth: 4522 Eventdatum: 25.01.22 – 27.01.22 Eventort: San Francisco Firmenkontakt und Herausgeber der Eventbeschreibung: FINETECH GmbH & Co. KGBoxberger Str. 1412681 BerlinTelefon: +49-30-936681-0Telefax: +49-30-936681-144http://www.finetech.de Weiterführende Links Zum Event Originalinserat von FINETECH GmbH & Co. KG Alle Events von FINETECH GmbH […]
With the FINEPLACER® pico 2 bonder, Finetech presents a new generation of the tried and tested micro assembly platform for product development. With an especially wide range of functions and simple operation, the Multi-Purpose-Bonder will continue to be an indispensable tool […]
Qualified rework of demanding SMD assemblies is the primary function of the FINEPLACER® coreplus. The rework system is particularly well suited for electronics development and production, where the spectrum of components includes the smallest assemblies on densely populated boards as well […]
Finetech, a leading provider of precision bonders and advanced rework equipment, announces the latest addition to the FINEPLACER® family, the FINEPLACER® femtoblu die bonding system. This automated micro assembly cell is an efficient and economical solution for dedicated photonics production. These demanding applications will […]
Finetech supports BMBF-funded "Quamapolis“ development project with high-precision placement and assembly systems for the integration of micro-optical components. A joint project called "Quamapolis", funded by the German Federal Ministry of Education and Research (BMBF) within the framework program "Quantum Technologies – […]
When a small part in your car breaks, you would find it absurd to dispose of the whole car – you repair the defective part instead. When extremely valuable assemblies worth as much as a car stop working, instead of […]
Collaboration is one of the most important driving forces for continued growth in any business. Kromek, a leading developer of radiation detection products, has been able to meet its growth demand through an effective 20 years collaboration with Finetech and […]
Finetech’s FINEPLACER® pico ma is a true laboratory die bonder with the virtues of a production system. A virtually unlimited range of functions, highly stable processes and up to 3 µm placement accuracy make the die bonder a cost-performance-leader. Around the […]
The Institute for Microelectronics in Stuttgart, Germany, is using a die bonder system from Finetech for the stacking of fragile membrane chips with a post-bond accuracy of less than one micrometer. The Institute for Microelectronics Stuttgart (IMS Chips) is engaged in business-oriented […]
https://www.finetech.de/knowledge/customer-stories/high-precision-die-bonder-for-the-electronic-coastr/ With 20,000 students across eight locations, the State University of South-Eastern Norway (USN) is one the largest educational institutions in the country. Originating from a merger of three regional colleges, the university today offers a wide spectrum of bachelor, master […]